2025年5月8日，全球第七屆半導(dǎo)體產(chǎn)業(yè)與電子技術(shù)（重慶）博覽會在重慶國際博覽中心盛大啟幕。作為中國頂尖的快樣及批量電路板生產(chǎn)商，深圳市金晟達(dá)電子技術(shù)有限公司攜核心技術(shù)與創(chuàng)新成果首次亮相這一行業(yè)盛會，以“精準(zhǔn)交付、高效賦能”為主題，向全球客戶展示其在通信、汽車電子、航空航天等領(lǐng)域的硬核實力。

On May 8, 2025, the 7th Global Semiconductor Industry and Electronic Technology Expo (Chongqing) grandly opened at the Chongqing International Expo Center. As a leading manufacturer of fast sample and batch circuit boards in China, Shenzhen Jinshengda Electronic Technology Co., Ltd. made its debut at this industry event with its core technologies and innovative achievements. With the theme of "Precise Delivery and Efficient Empowerment", it showcased its solid strength in the fields of communication, automotive electronics, aerospace, etc. to global customers.

首日聚焦：技術(shù)突破與行業(yè)標(biāo)桿的碰撞

The first day's focus: The collision of technological breakthroughs and industry benchmarks

展會首日，金晟達(dá)電路的展位（展位號：A108）便成為焦點。公司重點展示了其多層板快速樣單加工能力——一個工作日可完成180余款樣單，其中60%為高精度多層板，月產(chǎn)量突破5000平方米。這一技術(shù)實力已獲得華為、中興等頭部企業(yè)的“優(yōu)秀供應(yīng)商”認(rèn)證，并成功應(yīng)用于軍工、醫(yī)療器械等對可靠性要求嚴(yán)苛的領(lǐng)域。

On the first day of the exhibition, the booth of Jinshengda Circuit (Booth No. : A108) immediately became the focus. The company highlighted its rapid sample processing capability for multi-layer boards - it can complete over 180 sample orders within one working day, among which 60% are high-precision multi-layer boards, with a monthly output exceeding 5,000 square meters. This technological strength has been certified as an "Outstanding Supplier" by leading enterprises such as Huawei and ZTE, and has been successfully applied in fields with strict reliability requirements, such as military industry and medical devices.

現(xiàn)場工作人員透露，金晟達(dá)電路的“準(zhǔn)時交付”服務(wù)是其核心競爭力之一。通過智能化生產(chǎn)線與精益化管理，公司實現(xiàn)了從設(shè)計到量產(chǎn)的全流程高效協(xié)同，尤其針對中小批量訂單的快速響應(yīng)能力，成為眾多客戶選擇其合作的關(guān)鍵因素。

On-site staff disclosed that the "on-time delivery" service of Jinshengda Circuit is one of its core competencies. Through intelligent production lines and lean management, the company has achieved efficient collaboration throughout the entire process from design to mass production. Particularly, its rapid response capability for small and medium-sized batch orders has become a key factor for many customers to choose to cooperate with it.

戰(zhàn)略簽約：與全球伙伴共拓西部市場

Strategic Signing: Jointly expanding the Western market with Global Partners

展會首日，金晟達(dá)電路與多家國際知名企業(yè)達(dá)成戰(zhàn)略合作意向，涵蓋半導(dǎo)體封裝測試、智能網(wǎng)聯(lián)汽車電子等前沿領(lǐng)域。公司負(fù)責(zé)人表示：“重慶作為中西部電子信息產(chǎn)業(yè)高地，其‘芯屏器核網(wǎng)’全產(chǎn)業(yè)鏈布局與金晟達(dá)的技術(shù)方向高度契合。我們期待通過此次展會，深化與川渝地區(qū)產(chǎn)業(yè)鏈伙伴的合作，共同推動西部半導(dǎo)體產(chǎn)業(yè)升級。”

On the first day of the exhibition, Jinshengda Circuit reached strategic cooperation intentions with several well-known international enterprises, covering cutting-edge fields such as semiconductor packaging and testing, and intelligent connected vehicle electronics. The person in charge of the company stated: "As a highland of the electronic information industry in the central and western regions, Chongqing's full industrial chain layout of 'chips, screens, devices, cores and networks' is highly consistent with the technical direction of Jinshengda." We look forward to deepening cooperation with industrial chain partners in Sichuan and Chongqing through this exhibition and jointly promoting the upgrading of the semiconductor industry in the western region.

技術(shù)論壇：分享高精度PCB生產(chǎn)經(jīng)驗

Technical Forum: Sharing experience in high-precision PCB production

同期舉辦的“先進(jìn)封裝測試創(chuàng)新發(fā)展論壇”上，金晟達(dá)電路工程團(tuán)隊受邀發(fā)表主題演講，分享其在高密度互連（HDI）板、高頻高速材料應(yīng)用等領(lǐng)域的創(chuàng)新實踐。演講中，團(tuán)隊強(qiáng)調(diào)了“工藝穩(wěn)定性”與“客戶定制化需求”的平衡之道，并透露公司正投入研發(fā)新一代5G通信專用PCB技術(shù)，以滿足未來通信設(shè)備對信號完整性的更高要求。

At the concurrent "Advanced Packaging and Testing Innovation and Development Forum", the circuit engineering team of Jinshengda was invited to deliver a keynote speech, sharing its innovative practices in areas such as high-density interconnect (HDI) boards and high-frequency high-speed material applications. During the speech, the team emphasized the balance between "process stability" and "customized customer demands", and disclosed that the company is investing in the research and development of a new generation of 5G communication-specific PCB technology to meet the higher requirements for signal integrity in future communication equipment.

未來展望：以“芯”技術(shù)賦能產(chǎn)業(yè)生態(tài)

Future Outlook: Empowering the industrial ecosystem with "core" technology

隨著展會的持續(xù)推進(jìn)，金晟達(dá)電路將于明日（5月9日）在展位現(xiàn)場邀請行業(yè)專家、客戶代表共同探討PCB技術(shù)發(fā)展趨勢。公司表示，未來將持續(xù)加大在智能制造、綠色生產(chǎn)等領(lǐng)域的投入，助力全球電子產(chǎn)業(yè)鏈向更高效、更環(huán)保的方向邁進(jìn)。

As the exhibition progresses, Jinshengda Circuit will invite industry experts and customer representatives to discuss the development trends of PCB technology at its booth tomorrow (May 9th). The company stated that in the future, it will continue to increase investment in areas such as intelligent manufacturing and green production, and help the global electronic industry chain move towards a more efficient and environmentally friendly direction.

展會信息  Exhibition Information

• 時間  Time
  ：2025年5月8日-10日  May 8th - 10th, 2025
• 地點  Location

  ：重慶國際博覽中心（渝北區(qū)悅來大道66號）

   

  Chongqing International Expo Center (No. 66, Yuelai Avenue, Yubei District)
• 金晟達(dá)電路展位  JSDPCB Circuit Booth
  ：A208

展會首日，金晟達(dá)電路以技術(shù)實力與戰(zhàn)略眼光，為全球半導(dǎo)體產(chǎn)業(yè)注入新動能。未來兩天，更多精彩，敬請期待！

On the first day of the exhibition, Jinshengda Circuit, with its technological strength and strategic vision, injected new impetus into the global semiconductor industry. More exciting content awaits in the next two days. Stay tuned!